Author:
Dimitrakopoulos Christos D.,Kowalczyk Steven P.,Lee Kang-Wook
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference35 articles.
1. Copper/polyimide Materials System for High Performance Packaging
2. Multichip Module Technologies and Alternatives;Feger,1993
3. Polyimides;Bessonov,1987
4. Polyimides;Wilson,1990
Cited by
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