Dynamic mechanical and Fourier-transform infra-red analyses on the very late stage of the cure process in thermoset/thermoplastic blends: trifunctional epoxy/poly(ether sulfone)-Reference-Cited by-同舟云学术

Dynamic mechanical and Fourier-transform infra-red analyses on the very late stage of the cure process in thermoset/thermoplastic blends: trifunctional epoxy/poly(ether sulfone)

Published:1995-05 Issue:10 Volume:36 Page:1985-1989
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Kim Bong Sup,Inoue Takashi

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference15 articles.

1. Mechanisms of thermal degradation of phenolic condensation polymers. III. Cleavage of phenolic segments during the thermal degradation of uncured epoxy resins

2. Competitive primary amine/epoxy and secondary amine/epoxy reactions: Effect on the isothermal time-to-vitrify

3. Are cured epoxy resins inhomogeneous?

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