Examination of silicon wear debris generated in a linear scratch test
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Reference5 articles.
1. Size effects in abrasion of brittle materials;Puttick;J. Phys. D,1979
2. Deformation of silicon at low temperatures;Hill;J. Mater. Sci.,1974
3. Surface damage of single crystal silicon abraded in ethanol and deionized water;Lim;J. Mater. Sci.,1985
4. Microfracture beneath point indentations in brittle solids;Lawn;J. Mater. Sci.,1975
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1. Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers;Wear;2016-10
2. Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers;Journal of Engineering Materials and Technology;2012-09-04
3. Effect of crystallographic orientation on ductile scribing of crystalline silicon: Role of phase transformation and slip;Materials Science and Engineering: A;2012-07
4. Characterization and mechanical modeling of the abrasion properties of sintered tools with embedded hard particles;Wear;2003-04
5. Phase Transformations in Silicon Under Dry and Lubricated Sliding;Tribology Transactions;2002-01
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