Welding methods for joining thermoplastic polymers for the hermetic enclosure of medical devices

Author:

Amanat Negin,James Natalie L.,McKenzie David R.

Publisher

Elsevier BV

Subject

Biomedical Engineering,Biophysics

Reference116 articles.

1. The packaging of implantable integrated sensors;Bowman;IEEE Transactions on Biomedical Engineering,1986

2. Packaging of microfabricated devices and systems;Ko;Materials Chemistry and Physics,1995

3. The challenges for hermetic encapsulation of implanted devices—a review;Nichols;Critical Reviews in Biomedical Engineering,1994

4. Microsystem technologies for implantable applications;Receveur;Journal of Micromechanics and Microengineering,2007

5. A novel packaging approach for RF MEMS switching functions on alumina substrate;El Khatib;Microsystem Technologies,2007

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