Kinetics of solid-phase interactions in thin-film system with an excess of Cu-Reference-Cited by-同舟云学术

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Kinetics of solid-phase interactions in thin-film system with an excess of Cu

Published:1996-01 Issue:1 Volume:47 Page:61-65
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Uzunov TzD,Lambov SI,Stojanov StP

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference12 articles.

1. Investigation of reactive diffusion in the thin-film system CuTi

2. Intermetallic compound formations in titanium‐copper thin‐film couples

3. Card File (Diffraction Data Cards and Alphabetical and Grouped Numerical Index of X-ray Diffraction Data);American Society for Testing Materials,1969

4. Structure and Physical Properties of Rigid Body,1983

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1. Growth kinetics of intermetallic compounds in Cu–Ti diffusion couples;Intermetallics;2024-05

2. Microstructure and Friction–Wear Performance of Laser Cladded Cu10Al–Ti–MoS2 Coatings Under Oil Lubrication Condition;Transactions of the Indian Institute of Metals;2021-09-15

3. Development and application of interatomic potentials to study the stability and shear strength of Ti/TiN and Cu/TiN interfaces;Materials & Design;2020-11

4. Effect of temperature on morphology and wear of a Cu-Ti-TiC MMC sintered by abnormal glow discharge;Materials Research Express;2020-02-01

5. Investigation on corrosion behavior of Cu–TiO2 nanocomposite synthesized by the use of SHS method;Journal of Materials Research and Technology;2019-04

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