Stress relaxation of a eutectic alloy in the superplastic condition
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference16 articles.
1. Superplastic deformation of the Pb-Sn eutectic
2. A “creep yield stress” for superplastic deformation
3. Creep behaviour in the superplastic Pb–62% Sn eutectic
4. Stress Relaxation in the Sn-Pb Eutectic Alloy
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1. Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre‐strained eutectic Sn‐3.5Ag solder joints;Soldering & Surface Mount Technology;2006-01
2. The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb;Journal of Electronic Materials;2005-10
3. Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints;Journal of Materials Science: Materials in Electronics;2005-03
4. Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C;Journal of Electronic Packaging;2004-12-21
5. Effects of prestrain, rate of prestrain, and temperature on the stress-relaxation behavior of eutectic Sn-3.5Ag solder joints;Journal of Electronic Materials;2003-11
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