The effect of ion plating on the low cycle fatigue behavior of copper single crystals
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference40 articles.
1. An abnormal after-effect in metals
2. The flow stress gradient between the surface and centre of deformed copper single crystals
3. The effect of surface alloying on the plastic deformation behavior of copper
4. Interaction of dislocations with interfaces
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1. Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors;ACTA METALL SIN;2018
2. Thermal fatigue as a possible failure mechanism in copper interconnects;Thin Solid Films;2006-05
3. Ion implantation induced saturation stress decrease of body-centred cubic polycrystalline α-Fe by Ag+, Cr+, Y+ and Al+ in cyclic deformation;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1996-03
4. Cyclic strain localization in ion beam microalloyed nickel;Scripta Metallurgica et Materialia;1990-12
5. A finite element model of persistent slip band interaction with strengthened surface films during low cycle fatigue;Materials Science and Engineering: A;1990-12
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