Electrodeposition of osmium-Reference-Cited by-同舟云学术

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Electrodeposition of osmium

Published:2002-06 Issue:6 Volume:100 Page:84-90
ISSN:0026-0576
Container-title:Metal Finishing
language:en
Short-container-title:Metal Finishing

Author:

Jones Terence

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Polymers and Plastics,Pollution,Waste Management and Disposal

Reference20 articles.

1. www.Britannica.com; 2001

2. Platinum Metal Plating—A Process and Applicational Survey

3. U.S. Patent 3,622,474; Nov. 1971: U.S. Patent 3,644,692; Feb. 1972

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Stacked target irradiations and radiochemical separations for simultaneous production of short-lived Ni and Ir isotopes;Journal of Radioanalytical and Nuclear Chemistry;2023-06-14

2. Preparation and characterization of osmium films on quartz substrate by magnetron sputtering method;Surface and Coatings Technology;2015-11

3. Osmium Organosol on DNA: Application in Catalytic Hydrogenation Reaction and in SERS Studies;Industrial & Engineering Chemistry Research;2014-11-24

4. Electrically conducting osmium nano-chain networks with superior catalytic and SERS performance;RSC Adv.;2014-11-13

5. Enhanced catalytic and SERS activities of CTAB stabilized interconnected osmium nanoclusters;Phys. Chem. Chem. Phys.;2014-09-19

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