Effect of direct quenching on microstructure and mechanical properties of copper-bearing high-strength alloy steels
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. Technical note: Quality improvement of low carbon reinforcing steel by rapid heat treatment
2. Microstructure of a quenched and tempered Cu-bearing high-strength low-alloy steel
3. Effects of varying austenitizing temperature and cooling rate on the ability of HSLA-80 Steel to Achieve Impact Properties Comparable to HSLA-100 Steel
4. The influence of direct quenching from the forging temperature on the mechanical properties of a hardened boron containing steel
5. Continuous Controlled Rolling of a HSLA Steel
Cited by 59 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microstructure evolution and constitutive modeling of Cu-bearing high-strength low-alloy steel during hot deformation;Journal of Materials Research and Technology;2024-11
2. A Strategy for Simultaneous Increasement in the Strength-Ductility Balance of Directly-Quenched Ultra-High Strength Low Alloy Steel;Metals and Materials International;2024-09-06
3. Investigation of the Crystallographic Evolution Sequence of Nano-Precipitation via HRTEM in Cu-Bearing Ultra-Low Carbon Steel;Nanomaterials;2024-08-10
4. Laser powder bed fusion of high-strength low-alloy steels with post-heat treatment design for enhanced mechanical performance;Materials Science and Engineering: A;2024-03
5. Improvement of strength and toughness of 1 GPa Cu-bearing HSLA steel by direct quenching;Materials Science and Engineering: A;2022-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3