1. K. DeHaven, J. Dietz, Controlled collapse chip connection (C4)—an enabling technology, in: IEEE Conf. Proc. 44th ECTC, April 30–May 5, 1994, Washignton, DC, pp. 1–4.
2. J.F. Kuhmann, H.-J. Hensel, H.-G. Bach, Self-aligned flip-chip bonding technology for photonic devices, in: IEEE Conf. Proc. 46th ECTC, May 28–31, Orlando FL, 1996, pp. 1088–1092.
3. GaAs MQW modulators integrated with silicon CMOS
4. S. Bouwstra, Stacked multi-chip-module technology for high performance intelligent transducers, in: Proc. SPIE Conf., Vol. 2882, 14–15 October, Austin, TX, 1996, pp. 49–52.
5. P. Caillat, C. Massit, G. Nicolas, Flip chip for pixel organized devices, from IR camera to LHC particle detectors, in: Proc. 33rd ISHM–Nordic Conf., September 22–25, Helsingør, Denmark, 1996, pp. 150–153.