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HSW: Heuristic Shrink-wrapping for automatically repairing solid-based CityGML LOD2 building models

  • Published:2018-12 Issue: Volume:146 Page:289-304
  • ISSN:0924-2716
  • Container-title:ISPRS Journal of Photogrammetry and Remote Sensing
  • language:en
  • Short-container-title:ISPRS Journal of Photogrammetry and Remote Sensing

Author:

Zhao Junqiao,Ledoux HugoORCID,Stoter Jantien,Feng Tiantian

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

European Research Council

Natural Science Foundation of Shanghai

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Computers in Earth Sciences,Computer Science Applications,Engineering (miscellaneous),Atomic and Molecular Physics, and Optics

Reference45 articles.

1. A lightweight approach to repairing digitized polygon meshes;Attene;Vis. Comput.,2010

2. Direct repair of self-intersecting meshes;Attene;Graph. Models,2014

3. Polygon mesh repairing: an application perspective;Attene;ACM Computing Surveys (CSUR),2013

4. Remesh: An interactive environment to edit and repair triangle meshes;Attene,2006

5. Propagation of positional error in 3D gis: estimation of the solar irradiation of building roofs;Biljecki;Int. J. Geogr. Inform. Sci.,2015

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1. Preliminary Literature Survey on LoD of Geographic Information;2022 13th International Conference on Information and Communication Technology Convergence (ICTC);2022-10-19

2. Repairing geometric errors in 3D urban models with kinetic data structures;ISPRS Journal of Photogrammetry and Remote Sensing;2022-10

3. Weighted octree-based 3D indoor pathfinding for multiple locomotion types;International Journal of Applied Earth Observation and Geoinformation;2022-08

4. 3D building reconstruction from single street view images using deep learning;International Journal of Applied Earth Observation and Geoinformation;2022-08

5. Appearance-driven conversion of polygon soup building models with level of detail control for 3D geospatial applications;Advanced Engineering Informatics;2020-04
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