Estimating the L5S1 flexion/extension moment in symmetrical lifting using a simplified ambulatory measurement system
Author:
Funder
European Union’s Horizon 2020
Publisher
Elsevier BV
Subject
Rehabilitation,Biomedical Engineering,Orthopedics and Sports Medicine,Biophysics
Reference35 articles.
1. Placing the global burden of low back pain in context;Buchbinder;Best Pract. Res.: Clin. Rheumatol.,2013
2. Position and orientation in space of bones during movement: anatomical frame definition and determination;Cappozzo;Clin. Biomech.,1995
3. The effect of lifting during work on low back pain: a health impact assessment based on a meta-analysis;Coenen;Occup. Environ. Med.,2014
4. The contribution of load magnitude and number of load cycles to cumulative low-back load estimations: a study based on in-vitro compression data;Coenen;Clin. Biomech.,2012
5. Cumulative low back load at work as a risk factor of low back pain: a prospective cohort study;Coenen;J. Occup. Rehabil.,2013
Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Investigation of the Effect of Box Size on L5/S1 Joint in Manual Lifting;Journal of Materials and Mechatronics: A;2023-06-26
2. Flexible sensor-based biomechanical evaluation of low-back exoskeleton use in lifting;Ergonomics;2023-05-26
3. Development of a real time estimation method of L5S1 moments in occupational lifting;Journal of Biomechanics;2023-01
4. A Critical Review on Risk Assessment Methods of Musculoskeletal Disorder (MSD);Lecture Notes in Mechanical Engineering;2023
5. Multi-phase optimisation model predicts manual lifting motions with less reliance on experiment-based posture data;Ergonomics;2022-11-25
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3