Subject
Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. High sensitivity moiré;Post,1994
2. Voloshin A. Analysis of the thermal loading on electronics packages by enhanced moiré interferometry. In: John H. Lau editor. Thermal stress and strain in microelectronics packaging. New York: Van Nostrand Reinhold, 1993. p. 272–304 [chapter 8].
3. Development in optical methods for reliability analysis in electronic packaging applications;Guo;J Electron Packag,1998
4. Chua KM. Moiré interferometry in electronic packaging. Final year project report, Nanyang Technological University, Singapore, 1998.
5. Oh KE. Development, application of Moiré interferometric strain sensor. Internal report of School of Mechanical and Production Engineering, Nanyang Technological University, Singapore, 1999.
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献