Effect of thiourea and lead acetate on the deposition of electroless nickel

Author:

Lin Kwang-Lung,Hwang Jia-Wei

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference16 articles.

1. Application of electroless nickel plating in the semiconductor microcircuit industry;Wong;Plat. Surf. Finish.,1988

2. The interactions between In–Sn solders and an electroless Ni–P deposit upon heat treatment;Lin;J. Mater. Sci. Mater. Electr.,1996

3. T. Oppert, E. Zakel, T. Teutsch, A Roadmap to Low Cost Flip Chip and CSP using Electroless Ni/Au, IEMT/IMC Proceeding, 1998, pp. 106–113.

4. Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps;Aschenbrenner;IEEE Trans. Comp. Packag. Manuf. Technol. C,1997

5. Metal Handbook, Vol. 5, 9th Edition, American Society for Metals, Ohio, 1978, pp. 219–243.

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