Author:
Lin Kwang-Lung,Hwang Jia-Wei
Subject
Condensed Matter Physics,General Materials Science
Reference16 articles.
1. Application of electroless nickel plating in the semiconductor microcircuit industry;Wong;Plat. Surf. Finish.,1988
2. The interactions between In–Sn solders and an electroless Ni–P deposit upon heat treatment;Lin;J. Mater. Sci. Mater. Electr.,1996
3. T. Oppert, E. Zakel, T. Teutsch, A Roadmap to Low Cost Flip Chip and CSP using Electroless Ni/Au, IEMT/IMC Proceeding, 1998, pp. 106–113.
4. Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps;Aschenbrenner;IEEE Trans. Comp. Packag. Manuf. Technol. C,1997
5. Metal Handbook, Vol. 5, 9th Edition, American Society for Metals, Ohio, 1978, pp. 219–243.
Cited by
49 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献