Development of thermodynamic and kinetic databases in micro-soldering alloy systems and their applications-Reference-Cited by-同舟云学术

Development of thermodynamic and kinetic databases in micro-soldering alloy systems and their applications

Published:2011-04 Issue:2 Volume:21 Page:97-110
ISSN:1002-0071
Container-title:Progress in Natural Science: Materials International
language:en
Short-container-title:Progress in Natural Science: Materials International

Author:

LIU Xing-jun,WANG Cui-ping,OHNUMA Ikuo,KAINUMA Ryosuke,ISHIDA Kiyohito

Publisher

Elsevier BV

Subject

General Materials Science

Reference34 articles.

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5. NAPP D. Lead-free interconnect materials for the electronics industry [C]// Proceedings of the 27th International SAMPL Technical Conference. Albuquerque, NM, 1995.

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