Boosting plant-part segmentation of cucumber plants by enriching incomplete 3D point clouds with spectral data
Author:
Publisher
Elsevier BV
Subject
Soil Science,Agronomy and Crop Science,Food Science,Control and Systems Engineering
Reference23 articles.
1. Robust node detection and tracking in fruit-vegetable crops using deep learning and multi-view imaging;Boogaard;Biosystems Engineering,2020
2. Extending hyperspectral imaging for plant phenotyping to the UV-range;Brugger;Remote Sensing,2019
3. ROSE-X: An annotated data set for evaluation of 3D plant organ segmentation methods;Dutagaci;Plant Methods,2020
4. High-throughput phenotyping;Gehan;American Journal of Botany,2017
5. Validation of plant part measurements using a 3D reconstruction method suitable for high-throughput seedling phenotyping;Golbach;Machine Vision and Applications,2016
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3. The added value of 3D point clouds for digital plant phenotyping – A case study on internode length measurements in cucumber;Biosystems Engineering;2023-10
4. Using t-distributed stochastic neighbor embedding for visualization and segmentation of 3D point clouds of plants;Turkish Journal of Electrical Engineering and Computer Sciences;2023-09-29
5. Soybean-MVS: Annotated Three-Dimensional Model Dataset of Whole Growth Period Soybeans for 3D Plant Organ Segmentation;Agriculture;2023-06-28
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