Metallisation patterns for interconnection through holes-Reference-Cited by-同舟云学术

Metallisation patterns for interconnection through holes

Published:2001-01 Issue:1-4 Volume:65 Page:347-353
ISSN:0927-0248
Container-title:Solar Energy Materials and Solar Cells
language:en
Short-container-title:Solar Energy Materials and Solar Cells

Author:

Burgers A.R,Bultman J.H,Tip A.C,Sinke W.C

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. P.N. Jong, US Patent 3,903,428, 1975.

2. G.J. Pack, US Patent 3,903,427, 1975.

3. J.H. Bultman, M.W. Brieko, A.R. Burgers, J.H. Hoornstra, A.C. Tip, A.W. Weeber, The 11th International Photovoltaic Science and Engineering Conference, Sapporo, Japan, September 20–24, 1999 (in this issue).

4. Theoretical analysis of the series resistance of a solar cell

5. Optimization of multi-layer front-contact grid patterns for solar cells

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