Simulation study of a heat pump for simultaneous heating and cooling coupled to buildings
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Building and Construction,Civil and Structural Engineering
Reference23 articles.
1. IEA, International Energy Agency, Energy Technology Roadmaps, 2010.
2. La production simultanée d’eau glacée et d’eau chaude à 95°C par une thermofrigopompe d’une laiterie;Lecrivain;Revue Internationale du Froid,1982
3. The economics of heat pump systems for simultaneous heating and cooling;Ghosh;Heat Recovery Systems,1987
4. A new heat recovery technique for air-conditioning/heat-pump system;Gong;Applied Thermal Engineering,2008
5. Experimental investigation of a vapor compression heat pump used for cooling and heating applications;Fatouh;Energy,2011
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