Author:
Mirpuri Kabirkumar,Szpunar Jerzy
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference41 articles.
1. “National Technology Roadmap for Semiconductors”, SIA. 1994.
2. Full copper wiring in a sub-0.25 μm CMOS ULSI technology
3. Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
4. Proceedings of the IEEE international interconnect technology conference;Lee,2000
5. Proceedings of the IEEE international interconnect technology conference;Brongersma,1999
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