Effect of transient liquid phase (TLP) bonding on the ductility of a Ni-base single crystal superalloy in a stress rupture test

Author:

Liu J.D.,Jin T.,Zhao N.R.,Wang Z.H.,Sun X.F.,Guan H.R.,Hu Z.Q.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference27 articles.

1. Creep-behavior modeling of the single-crystal superalloy CMSX-4;MacLachlan;Metall Trans,2000

2. Microstructure and bonding behavior of a new Hf-bearing interlayer alloy for single crystal nickel-base superalloy;Ruan;Scr Mater,1996

3. TLP bonding: a new method for joining heat resistant alloys;Duvall;Weld J,1974

4. Bonding phenomena and joint properties of transient liquid phase bonding of Ni-base single crystal superalloys;Nishimoto;Weld World,1998

5. Study of Ni–Cr–Co–W–Mo–B interlayer alloy and its bonding behavior for a Ni-base single crystal superalloy;Li;Scr Mater,2003

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