Development of microstructure and texture in Copper during warm accumulative roll bonding-Reference-Cited by-同舟云学术

Development of microstructure and texture in Copper during warm accumulative roll bonding

Published:2012-08 Issue: Volume:70 Page:74-82
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Suresh K.S.,Sinha Subhasis,Chaudhary Abhishek,Suwas Satyam

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference45 articles.

1. Bulk nanostructured materials from severe plastic deformation;Valiev;Prog Mater Sci,2000

2. Principles of equal-channel angular pressing as a processing tool for grain refinement;Valiev;Prog Mater Sci,2006

3. Evolution of crystallographic texture during equal channel angular extrusion of copper: the role of material variables;Suwas;Met Mater Trans A,2006

4. Texture and grain boundary character distribution during equal channel angular extrusion of some two-phase copper alloys;Suwas;Mater Sci Forum,2008

5. Evolution of texture during equal channel angular extrusion of commercially pure aluminum: experiments and simulations;Suwas;Mater Sci Eng A,2009

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