Characterization of transient-liquid-phase-bonded joints in a duplex stainless steel with a Ni–Cr–B insert alloy

Author:

Yuan Xinjian,Kim Myung Bok,Kang Chung Yun

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference39 articles.

1. TLP bonding: a new method for joining heat resistant alloys;Duvall;Weld J,1974

2. Principles of soldering and brazing;Humpston,1993

3. Transient liquid-phase bonding in the Ni–Al–B system;Campbell;Metall Mater Trans,2000

4. Microstructural evolution in the transient-Liquid-Phase bonding area of IN-738LC/BNi-3/IN-738LC;Mosallaee;Metall Mater Trans,2008

5. Study of N–Cr–Co–W–Mo–B interlayer alloy and its bonding behaviour for a Ni-base single crystal superalloy;Li;Scr Mater,2003

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