AlCu alloy films prepared by the thermal diffusion technique

Author:

Oliva A.I.,Corona J.E.,Sosa V.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference29 articles.

1. Microstructure and resistivity characterization of CuAu I superlattice formed in Cu/Au thin films;Zhang;J Vac Sci Technol B,2004

2. Measurement of the heat capacity of copper thin films using a micropulse calorimeter;Yu;J Heat Trans,2010

3. Reduction of resistivity in Cu thin films by partial oxidation: microstructural mechanisms;Prater;Appl Phys Lett,2004

4. Observation of electronic and atomic shell effects in gold nanowires;Mares;Phys Rev B,2004

5. Electromigration in ULSI interconnects;Tan;Mater Sci Eng R,2007

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