Author:
Ari M.,Saatçi B.,Gündüz M.,Meydaneri F.,Bozoklu M.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
32 articles.
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1. The electronic, magnetic and half-metallic predictions of Mx (M = Ag, Cd, Y, Zr, Nb, and x = 0, 0.125, 0.25, 1)W1-xSn alloys;Philosophical Magazine;2022-06-21
2. Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu;Journal of Materials Science: Materials in Electronics;2020-04-10
3. Surface tension modelling of liquid Cd–Sn–Zn alloys;Philosophical Magazine;2018-03-12
4. STRUCTURAL, SURFACE AND TRANSPORT PROPERTIES OF Sn–Ag ALLOYS;Surface Review and Letters;2017-03-30
5. Effect of silicon content on microstructure, mechanical and electrical properties of the directionally solidified Al–based quaternary alloys;Journal of Alloys and Compounds;2017-02