Microstructure development of Y–Ti–O dispersion strengthened Cu alloys fabricated by mechanical alloying-Reference-Cited by-同舟云学术

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Microstructure development of Y–Ti–O dispersion strengthened Cu alloys fabricated by mechanical alloying

Published:2022-04 Issue: Volume:186 Page:111808
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Zhao Mi,Xu Boyang,Zhang Peng,Xu Junjie,Jiang Yong,Liu Feng,Yan Youwei

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference65 articles.

1. Ultrahigh strength and high electrical conductivity in copper;Lu;Science,2004

2. Microstructures and textures of a Cu–Ni–Si alloy processed by high-pressure torsion;Khereddine;J. Alloys Compd.,2013

3. Evaluation of high strength, high conductivity CuNiBe alloys for fusion energy applications;Zinkle;J. Nucl. Mater.,2014

4. Enhanced strength and electrical conductivity of Cu–Zr–B alloy by double deformation-aging process;Ye;J. Alloys Compd.,2014

5. A high strength and high electrical conductivity bulk CuCrZr alloy with nanotwins;Sun;Scr. Mater.,2015

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1. Microstructure and tensile properties of Y2O3-dispersion strengthened CoCrFeNi high entropy alloys prepared via mechanical alloying using pre-alloyed powder;Journal of Materials Research and Technology;2024-11

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3. A practical method to improve mechanical and electrical properties of ADS copper prepared by cold spray additive manufacturing through powder pretreatment;Journal of Alloys and Compounds;2023-11

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