Enhancement of load transfer by interfacial bonding in Al-Cu-Mg joints under the in-situ synergistic effect of carbon nanotubes and silicon nitride-Reference-Cited by-同舟云学术

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Enhancement of load transfer by interfacial bonding in Al-Cu-Mg joints under the in-situ synergistic effect of carbon nanotubes and silicon nitride

Published:2022-09 Issue: Volume:191 Page:112144
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Xu Tianyu,Ma Xiuquan,Zhang Lin,Li Meng,Zhou Shaowei,Wu Han,Zhu Zhengwu

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference41 articles.

1. Effect of Si addition on the microstructure and mechanical properties of Al–Cu–Mg alloy;Wang;J. Alloys Compd.,2014

2. Progress in structural materials for aerospace systems;Williams;Acta Mater.,2003

3. Early ageing mechanisms in a high-copper AlCuMg alloy;Abis;Scr. Mater.,2001

4. Effect of post-heat treatment on microstructure and mechanical properties of laser welded Al-Cu-Mg alloy;Malikov;J. Manuf. Process.,2021

5. Microstructure and mechanical properties of underwater friction stir welding of CNT/Al-Cu-Mg composites;Li;J. Mater. Res. Technol.,2022

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