Grain boundary migration behavior and microstructure evolution during multilayer additive hot-compression bonding
Author:
Funder
National Natural Science Foundation of China
Key Technologies Research and Development Program
National Key Research and Development Program of China
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
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4. Leading manufacture of the large-scale weldless stainless steel forging ring: innovative approach by the multilayer hot-compression bonding technology;Sun;J Mater Sci Technol,2021
5. Interface microstructure evolution and bonding mechanism during vacuum hot pressing bonding of 2A12 aluminum alloy;Xu;Mater Char,2022
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