Microstructure and electrical contact behavior of Al2O3–Cu/30W3SiC(0.5Y2O3) composites-Reference-Cited by-同舟云学术

Microstructure and electrical contact behavior of Al2O3–Cu/30W3SiC(0.5Y2O3) composites

Published:2023-01 Issue: Volume:22 Page:2158-2173
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Zheng Xianhua,Zhou Meng,Zhang Yi,Huang Jinliang,Li Yunzhang,Zhu Hanjing,Tang Shunlong,Li De,Liang Shengli,Tian Baohong,Liu Yong,Li Xu,Jia Yanlin,Volinsky Alex A.

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference55 articles.

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4. The wear and arc erosion behavior of novel copper based functionally graded electrical contact materials fabricated by hot pressing assisted electroless plating;Güler;Adv Powder Technol,2021

5. Work softening behavior of Cu–Cr–Ti–Si alloy during cold deformation;Yuan;J Mater Res Technol,2019

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