Novel application of a thermoplastic composite with improved matrix-fiber interface
Author:
Funder
Interreg SUDOE
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference40 articles.
1. Thermoplastic composites – recyclable and fast to process;Stewart;Reinf Plast,2011
2. Weldability of thermoplastic materials for friction stir welding—a state of art review and future applications;Kumar;Compos B: Eng,2018
3. Recent advances in carbon-fiber-reinforced thermoplastic composites: a review;Yao;Compos B: Eng,2018
4. Influence of chemical treatments on mechanical properties of hemp fiber reinforced composites;Sepe;Compos B: Eng,2018
5. Influence of plasma treatment on the adhesion between a polymeric matrix and natural fibres;Enciso;Cellulose,2017
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