High temperature creep study on thermally grown oxide by tensile combined with a digital image correlation method
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
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5. Predicting failure within TBC system: finite element simulation of stress within TBC system as affected by sintering of APS TBC, geometry of substrate and creep of TGO;Si;Eng Fail Anal,2013
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