Investigation of joint interface and cracking mechanism of thick cladding of copper on aluminum by equal channel angular pressing (ECAP)
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference29 articles.
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3. Formation of ultra-fine copper grains in copper-clad aluminum wire;Sasaki;Scr Mater,2010
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