Thermal conduction and strength of diamond-copper composite sandwich obtained by SPS diffusion bonding with Ti interlayer
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
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1. Fabrication and heat dissipation performance of diamond/Cu composite with diamond bars inserted in the normal direction;Journal of Alloys and Compounds;2024-07
2. Preparation of micro-diamond/copper composite foils by direct current electro-deposition method and its properties;Diamond and Related Materials;2024-05
3. Improved Mechanical Properties of W-Zr-Ti-Nb Alloys Via Adding Ti and Nb;2024
4. Improved Mechanical Properties of W-Zr-Ti-Nb Alloys Via Adding Ti and Nb;2024
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