Author:
Prasad N.N.V.,Aliabadi M.H.,Rooke D.P.
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation
Reference13 articles.
1. Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method
2. Thermomechanical Fatigue Behaviour of Materials;Sakon,1993
3. Crack growth induced by thermal-mechanical loading
4. 14th Nat. Symp. on Fracture Mechanics;Ingraffea,1987
5. Finite and boundary element modelling of crack propagation in two- and three-dimensions using interactive computer graphics;Gerstle,1986
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13 articles.
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