HVDC transmission line computations using finite element and characteristics method
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Biotechnology,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. IEE conference on H.V.D.C. transmission;Lane,1966
2. The chemistry of corona degradation of organic insulating materials in high-voltage fields and under mechanical strain;McMahon;IEEE Trans. Electr. Insul.,1968
3. The Minnesota power-line wars;Mains;IEEE Spectrum,1983
4. The public health implications of HVDC transmission lines: an assessment of the available evidence;Banks;IEEE Trans. Power Appar. Syst.,1983
5. Über die Dichtverteilung Unipolarer lonenstrome;Deutsch;Ann. Phys.,1933
Cited by 62 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Diminishing the right of way (RoW) with multi voltage multi terminal transmission tower;AIP Conference Proceedings;2024
2. An efficient AMG based composite solver for the fully coupled solution of the large scale ion flow field problem;Electric Power Systems Research;2023-01
3. Estimating the environmental impacts of HVDC and UHVDC lines for large-scale wind power transmission considering height-dependent wind and atmospheric stability;International Journal of Electrical Power & Energy Systems;2022-06
4. A Novel and General Approach for Solving the Ion-Flow Field Problem by a Regularization Technique;IEEE Transactions on Power Delivery;2021-12
5. Measurement and assessment of corona current density for HVDC bundle conductors by FDM integrated with full multigrid technique;Electric Power Systems Research;2021-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3