Review on Brazing of High Volume Faction SiC p /Al Composites for Electronic Packaging Applications
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference52 articles.
1. Coefficients of thermal expansion of metal-matrix composites for electronic packaging
2. Electronic Packaging Materials and Their Properties[M];Pecht,1998
3. Aluminum composite materials for multichip modules
4. Microstructure and thermo-physical properties of a SiC/pure-Al composite for electronic packaging
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