Structure and Mechanical Properties of Cu/AlN Nano-composites with High Strength and High Conductivity
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference12 articles.
1. Vacuum infiltration of copper aluminate by liquid aluminium
2. Effect of cold-working and aging processes on the microstructure, mechanical properties and electrical conductivity of Cu–13.5%Mn–4%Ni–1.2%Ti alloy
3. Effects of Diffusion Bonding Conditions on Joint Strength of Chromium Copper
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