Enhancing oxidation resistance of Cu during repeated melting by the in-situ formation of protective oxide films-Reference-Cited by-同舟云学术

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Enhancing oxidation resistance of Cu during repeated melting by the in-situ formation of protective oxide films

Published:2021-03 Issue: Volume:286 Page:129234
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Guo Yongli,Cai Hui,Wang Zhe,Wang Xin,Cao Peng,Chen Pengyu,Wang Yaping

Funder

Shaanxi Key Science and Technology Innovation Team Project

National Natural Science Foundation of China

Natural Science Basic Research Program of Shaanxi Province

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference9 articles.

1. Enhanced electrical conductivity and hardness of Copper/Carbon Nanotubes composite by tuning the interface structure

2. Surface coordination layer passivates oxidation of copper

3. Oxidation Resistance of Iron and Copper Foils Coated with Reduced Graphene Oxide Multilayers

4. Electroless silver coating on fine copper powder and its effects on oxidation resistance

5. Oxidation Resistance of Graphene-Coated Cu and Cu/Ni Alloy

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Copper inks for printed electronics: a review;Nanoscale;2022

2. Regulating the oxidation resistance of Cu-5Ag alloy by heat treatment;Corrosion Science;2021-09

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