Preparation and sintering properties of Cu10Sn3 IMCs nanopaste as die attach material for high temperature power electronics
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Preparation and characterization of Cu3Sn nanoparticles via a facile ultrasonic irradiation
2. Pressure-assisted electrode fabrication using simply synthesized Cu3Sn alloy nanoparticles
3. Nanostructured Sn-M (M = Cu, Mg and Fe) intermetallic alloys and their electrochemical activity as anode electrodes in a Li-ion battery
4. Single-Crystal Intermetallic M−Sn (M = Fe, Cu, Co, Ni) Nanospheres as Negative Electrodes for Lithium-Ion Batteries
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study;Surface and Coatings Technology;2024-05
2. Investigation of ethylene glycol, α-terpineol, and polyethylene glycol 400 on the sintering properties of Cu–Ag core–shell micro/nano-mixed paste;Journal of Materials Science: Materials in Electronics;2023-07
3. Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu3Sn Paste for High-Power Electronics Packaging;ACS Applied Electronic Materials;2022-07-05
4. Transient solid-liquid interfacial reaction between Al wire and Au/Cu pad during parallel gap micro-resistance welding;Materials Letters;2021-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3