Preparation and characterization of thermally-conductive silane-treated silicon nitride filled polybenzoxazine nanocomposites
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference13 articles.
1. Ceramic – fiber – polymer composi or electronic substrates;Bolt;Mater Sci Eng A.,1989
2. Polybenzoxazine-based composites as high performance materials;Kiskan;Polym Int.,2011
3. Alloys and Composites of Polybenzoxazines;Rimdusit,2013
4. Mechanical and thermal properties of silicon nitride reinforced polybenzoxazine nanocomposites;Ramdani;Compos Sci Technol,2014
5. Preparation and properties of polyimide/aluminum nitride composites;Xie;Polym Test.,2004
Cited by 46 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Protruding Boron Nitride Nanotubes on the Al2O3 Surface Enabled by Tannic Acid-Assisted Modification to Fabricate a Thermal Conductive Epoxy/Al2O3 Composite;ACS Omega;2024-09-05
2. Characterization of silane-treated wheat husk biomass Si3N4 and castor stem sheath fibre-epoxy composite;Biomass Conversion and Biorefinery;2024-07-16
3. Synthesis of novel Stachytarpheta jamaicensis flower liked hexagonal boron nitride nanoribbons (SJF-BNNBs) to efficiently improve the thermal/mechanical/electrical properties of flexible polyimide films;Composites Part B: Engineering;2024-07
4. Thermal Behaviour of Epoxy Composites Filled with Micro-sized LD Slag Particulates;Jordan Journal of Mechanical and Industrial Engineering;2023-12-01
5. A Comprehensive Study on the Effect of Highly Thermally Conductive Fillers on Improving the Properties of SBR/BR-Filled Nano-Silicon Nitride;ACS Omega;2023-08-29
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3