Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation-Reference-Cited by-同舟云学术

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Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation

Published:2024-12 Issue: Volume:377 Page:137394
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Zhang Shuai^ORCID,Quan Xuesong,Lin Changhao,Cao Liqiang,Chen Xiangyu,Liu Jinhong,Qiu Qingyang^ORCID,Xu Sunwu,He Peng,Zhang Shuye^ORCID

Funder

Key Laboratory of Silicon Device Technology

Publisher

Elsevier BV

Reference15 articles.

1. The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates;Zhang;J. Mater. Res. Technol.,2023

2. A review of the study on the electromigration and power electronics;Rahman;J. Electron. Cool. Therm. Control.,2016

3. Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects;Liang;Microelectron. Reliab.,2017

4. Influence of Ni foam/Sn composite solder foil on IMC growth and mechanical properties of solder joints bonded with solid-liquid electromigration;Mao;Intermetallics,2021

5. B.Y. Wu, M.O. Alam, Y.C. Chan, H.W. Zhong, Joule heating enhanced phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu solder joints during current stressing, J. Electron. Mater. 37 (2008) 469–476.

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