Effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu and SnPb solders with Au/Ni/Cu substrate during aging
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. Tin–lead (SnPb) solder reaction in flip chip technology
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Lead-free Solders in Microelectronics
4. Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization
5. Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
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