Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector–electrode interfaces-Reference-Cited by-同舟云学术

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Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector–electrode interfaces

Published:2016-01 Issue: Volume:162 Page:250-253
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Boccaccini D.N.,Sevecek O.,Frandsen H.L.,Dlouhy I.,Molin S.,Cannio M.,Hjelm J.,Hendriksen P.V.

Funder

Brno University of Technology

energinet.dk

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference7 articles.

1. Fast performance degradation of SOFC caused by cathode delamination in long-term testing

2. Introduction to Metal–Ceramic Technology;Naylor,1992

3. Curvature and stresses for bi-layer functional ceramic materials

4. A numerical tool to estimate SOFC mechanical degradation: Case of the planar cell configuration

5. Bond strength of metal-ceramic systems in three-point flexure bond test

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