Influence of temperature on the deformation behaviors of melamine–formaldehyde microcapsules containing phase change material
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference13 articles.
1. Interface stability behaviors of methanol–melamine–formaldehyde shell microPCMs/epoxy matrix composites;Su;Polym Compos,2011
2. Preparation and characterization of double-MF shell microPCMs used in building materials;Su;J Appl Polym Sci,2005
3. Micromechanical behavior of self-healing epoxy and hardener-loaded microcapsules by nanoindentation;Lee;Mater Lett,2012
4. Mechanical properties and thermal stability of double-shell thermal-energy-storage microcapsules;Su;J Appl Polym Sci,2007
5. Mechanical properties of microcapsules used in a self-healing polymer;Keller;Exp Mech,2006
Cited by 38 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microencapsulation of eutectic phase change materials for temperature management of the satellite electronic board;Applied Thermal Engineering;2024-01
2. Processing of calcium sulfoaluminate eco-cement coatings containing microencapsulated phase change materials;Advances in Cement Research;2023-11-11
3. Shielding Encapsulation to Enhance Fire Endurance of Phase Change Materials in Energy-Efficient Concrete;Fire Technology;2023-04-12
4. Size-tunable CaCO3@n-eicosane phase-change microcapsules for thermal energy storage;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2022-05
5. Microencapsulation of lauryl alcohol through in-situ polymerization for thermal energy storage application;HIGH TEMP-HIGH PRESS;2022
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3