In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction-Reference-Cited by-同舟云学术

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In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction

Published:2015-01 Issue: Volume:139 Page:42-45
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Huang M.L.,Yang F.,Zhao N.,Zhang Z.J.

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. Lead-free Solders in Microelectronics

2. Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

3. Growth kinetics of chemical compound layers;Dybkov,1998

4. Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow

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1. Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances;Materials Today Communications;2024-06

2. Comparative study on the bonding property of laser and reflow soldered Sn-3.0Ag-0.5Cu/Ni–P microbumps after isothermal aging and multiple reflowing;Journal of Materials Research and Technology;2024-03

3. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints;Materials;2023-03-26

4. Recent progress on apparatus development and in situ observation of metal solidification processes via synchrotron radiation X-ray imaging: A review;Transactions of Nonferrous Metals Society of China;2022-08

5. Formation and evolution of irregularly arranged prism-type Cu6Sn5 grains on electroplated (111) textured Cu;Journal of Materials Science;2022-01-22

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