Microstructure evolution and anti-wear mechanism of Cu film fabricated by magnetron sputtering deposition
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference10 articles.
1. Correlation between strengthening and damage of Cu refined by different SPD processing and friction in different lubricant regions
2. Plastic deformation of pure copper in ultrasonic assisted micro-tensile test
3. Comparisons of dry sliding tribological behaviors between coarse-grained and nanocrystalline copper
4. Uniform high-reflectivity silver film deposited by planar magnetron sputtering
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