Author:
Shigetou Akitsu,Hosoda Naoe
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
2 articles.
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1. A Review of Mechanism and Technology of Hybrid Bonding;Journal of Electronic Packaging;2024-07-25
2. Keys in Hybrid Bonding for Automotive IoT in Next Generation;The Journal of The Institute of Electrical Engineers of Japan;2022-11-01