Author:
Lee Sang Young,Mack Jerry,Young Kim Hae,Jung Sung-Hoon,Rathi Somilkumar J.,Mukherjee Niloy
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference16 articles.
1. Barrier layers for Cu ULSI metallization
2. Momtchil Stavrev, Dirk Fischer, Frank Praessler, Christian Wenzel, and Kurt Drescher, J. Vac. Sci. Technol. A 17(3), May/Jun 1999.
3. Evaluation of LPCVD MeSiN (MeTa, Ti, W, Re) diffusion barriers for Cu metallizations
4. Jin-Seong Park, Sang-Won Kang, and H. Kim, J. Vac. Sci. Technol. B 24(3), May/Jun 2006.
5. Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献