Fabrication of mesoporous silica KIT-6/polymer composite and its low thermal expansion property
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference10 articles.
1. Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices
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3. Cryogenic mechanical behaviors of MMT/epoxy nanocomposites
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5. Towards Thermoconductive, Electrically Insulating Polymeric Composites with Boron Nitride Nanotubes as Fillers
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