Adhesion strength between electroformed nickel structures and AISI 304L stainless steel substrates

Author:

Başkan Mertcan,Erdoğan Metehan,Karakaya İshak

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference11 articles.

1. Synthesis of smooth copper deposits by simultaneous electroforming and polishing process;Zhu;Mater. Lett.,2008

2. Mechanical and metallurgical characterisation of electroformed nickel for helicopter erosion shield applications;Davies;Mater. Sci. Eng. A,2014

3. Micromanufacturing technologies of compact heat exchangers for hypersonic precooled airbreathing propulsion: A review;Meng;Chinese J. Aeronaut.,2021

4. Damage localization effects of the regeneratively-cooled thrust chamber wall in LOX/methane rocket engines;Song;Chinese J. Aeronaut.,2018

5. ASTM B 571, “Standard Practice for Qualitative Adhesion Testing of Metallic Coatings,” October, vol. 97, no. Reapproved, pp. 97–100, 2000, doi: 10.1520/B0571-18.substrate.

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