Creep behaviors of nanocrystalline copper after stress reduction under nanoindentation at ambient temperature
Author:
Funder
Basic Public Welfare Research Program of Zhejiang Province
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference14 articles.
1. Plastic deformation behavior during unloading in compressive cyclic test of nanocrystalline copper
2. Uniting tensile ductility with ultrahigh strength via composition undulation
3. Dynamic recovery in nanocrystalline Ni
4. Interpretation of unloading tests on nanocrystalline Cu in terms of two mechanisms of deformation
5. Seventy years of Hall-Petch, ninety years of superplasticity and a generalized approach to the effect of grain size on flow stress
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1. Micromechanical characterization of zirconia and silicon nitride ceramics using indentation and scratch methods;Ceramics International;2024-06
2. Microstructure and Mechanical Property of Mg-13Gd-0.2Ni Alloy Processed by Extrusion and Aging;Acta Metallurgica Sinica (English Letters);2024-05-17
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